Lead free soldering process 

Our products are lead-free since end of 2004, but it is to attend: 

Lead-free products can be soldered lead-free and plumbiferous, but plumbiferous products cannot be soldered at a lead-free soldering process! 

The following RoHS conformable alloys are used at the soldering-pads and the final surfaces of the products: 

1. Sn/Cu (99,7%/0,3%; 97%/3%) for „through hole“ technique 

2. 100% Sn for SMD products 

3. Sn/Ag/Cu (96,5%/3,0%/0,5%) wired connection on metal base at SMD-products; in part „through hole“ technique 

Download Lead Free soldering profile 

Cliquer ici pour lancer le téléchargement [Lead_free_soldering_profile.pdf]